Candidatei-me por meio de uma faculdade ou universidade. O processo levou 6 dias. Fui entrevistado pela Apple (Boston, MA) em abr. de 2013
Entrevista
They asked about my personal projects and engineering experience. They wanted to know what was a particularly challenging project for me and went into detail, asking how I solved certain problems. They were interested in my process... What options I considered to solve certain problems, how I went about testing, prototyping, analyzing, and movie forward. Then they asked some technical questions. It appeared to me that they want you to think allowed and analyze edge cases to help you intuit the problem.
Perguntas de entrevista [1]
Pergunta 1
If you have a cantilevered beam with a load at the unsupported end, what can you change about the beam to mitigate the effect of the load.
Fiz uma entrevista na empresa Apple (Shenzhen, Guangdong).
Entrevista
i had my interview today and was asked the same question. also similarly, the interviewer had no sense of humor. it was not a enjoyable experience because i think i gave like 3-4 different ways of making a cantilever, but i was asked "what else?" like 10 times for the cantilever problem alone. i also have 7 years of work experience, but there was 0 question asked about it.
Perguntas de entrevista [1]
Pergunta 1
What causes corrosion, and how do you design to mitigate it?
The interview went well overall. The interviewer opened with a discussion about a project I'm proud of, then a beam scenario question that covered structural and load analysis, stress and deflection, and material selection — testing my ability to connect first-principles thinking across the full problem space.
Candidatei-me por meio de uma faculdade ou universidade. Fui entrevistado pela Apple (Cupertino, CA) em abr. de 2026
Entrevista
Interview with hiring manager then virtual onsite. They ask you general mechanical engineering questions as well as questions dependent on type of team and skills they are looking for. Not bad overall just brush up on basic beam deflection, GD&T, Design analysis etc.