The phone screening is very nice. I spoke with a recruiter about my resume and he moved me onto the next round. Second interview is a technical interview which involved a video call with an engineer. The engineer did not exactly have a warm or welcoming demeanor. In fact, it seemed like he was bored and disinterested from the start. He asked me a series of technical questions but I unfortunately did not perform well under the pressure.

There were 1 screening and 6 panel rounds and it was difficult especially UVM part also they AMBA protocols basic design questions like fsm fifo and all and more focus on constraints