three round of interviews, first technical and second HR round and then client round if needed as per project and requirement .
Sometimes Managerial round in some projects for higher band resource
Perguntas de entrevista [1]
Pergunta 1
Normal SAP hybris questions were asked easy to crack
Candidatei-me de outra forma. O processo levou 1 semana. Fiz uma entrevista na empresa IBM (Chennai).
Entrevista
It was very smooth and easy to crack if technically strong
It was very smooth and easy to crack if technically strong
It was very smooth and easy to crack if technically strong
Clear and clean interview process
2 rounds only
Finally HR round
Within 3 days offered to me .
Hr are very professional
To good tech team
Onboarding process is very good
Perguntas de entrevista [1]
Pergunta 1
About technical
Certification
Ethical
Longer
Communication
