Candidatei-me por meio de uma faculdade ou universidade. O processo levou 5 dias. Fui entrevistado pela Texas Instruments (Jalandhar, Punjab) em out. de 2021
Entrevista
One coding round. Level: Medium
Interview rounds:
2 rounds.
Level: Hard to Crack.
Questions on DSA, OS, DBMS, Linux and projects were asked.
The DSA Questions included topics like Sliding window, string manipulation, dynamic programming.
Perguntas de entrevista [1]
Pergunta 1
Questions related to DevOps, DBMS, OS and Data structures.
First of all OA round took place. Then there was only one round interview. Questions were a mix of different topics like computer fundamentals , oops, and one dsa question from graphs.
Candidatei-me por meio de uma faculdade ou universidade. O processo levou 1 semana. Fui entrevistado pela Texas Instruments (Campus) em ago. de 2025
Entrevista
first was OA which was of 3 sections and each sections has separate time constrain which include basic math algebra probabilty and other include os dbis oops etc..and last is coding round which has 2 questions
next round was interview
Perguntas de entrevista [1]
Pergunta 1
in the interview they asked about my project which i mentioned on the resume and asked about it for around 20 mins
then live coding gave 3 questions
Fiz uma entrevista na empresa Texas Instruments (Indi, Karnataka).
Entrevista
We initially has an OA round and then the short listed students gave the Interview. They asked easy to medium leetcode questions and the HR round was quite smooth. It was a smooth process
