Candidatei-me por meio de uma faculdade ou universidade. O processo levou 2 semanas. Fui entrevistado pela Corning em jul. de 2018
Entrevista
I had two calls with their R&D engineers, both projects related to FPGAs. One of the senior guys said that he wanted to print me on board to work on a new FPGA project for their testing equipment.