Candidatei-me por meio de uma faculdade ou universidade. O processo levou 3 semanas. Fui entrevistado pela HP Inc. em nov. de 2017
Entrevista
On-campus interview for an electrical engineering position. I had a good time talking to a current engineer for about 45 minutes. Some technical questions on circuits and digital logic, and typical behavioral questions. Then had an hour phone call with an engineer on one of the teams at HP about my previous experience and life at HP. Lastly, had a call with the manager of the team and was eventually offered the position
Perguntas de entrevista [1]
Pergunta 1
What is a flip flop? Draw the current diagram of a diode. Draw an inverting op-amp.
Candidatei-me online. O processo levou mais de 1 semana. Fiz uma entrevista na empresa HP Inc..
Entrevista
The hiring and interview process wasn't long. Screening interview then a site tour + face to face interview with the team. The team were nice. Some questions were more specific to the job. They have high expectations so be prepared.
Perguntas de entrevista [1]
Pergunta 1
How did you work through a tough experience/period in your life?
Candidatei-me por meio de uma faculdade ou universidade. O processo levou 5 dias. Fui entrevistado pela HP Inc. (Seattle, WA) em nov. de 2019
Entrevista
On-campus networking session and application followed by an in person 45 minute behavioral and technical interview. The technical interview was split between a general engineering and major focused section. I was given a materials science interview for the second portion.
Perguntas de entrevista [1]
Pergunta 1
What is the glass transition temperature of a polymer?
Candidatei-me por meio de uma faculdade ou universidade. Fui entrevistado pela HP Inc. em set. de 2018
Entrevista
Got an interview during campus recruitment. Panel of two. Whole interview lasted about an hour. Asked many behavior and technical questions very detailed. After having not heard from them for 4 mo got the rejection letter.