Candidatei-me por meio de uma faculdade ou universidade. O processo levou mais de 1 semana. Fui entrevistado pela Texas Instruments (Champaign, IL) em out. de 2015
Entrevista
After attending a career fair, I was invited to a behavioral and technical interview on campus the next day. I was then instructed to call a managing engineer at the Dallas site and we had an eased conversation about my familiarity with the semiconductor industry. Overall, the interview was not challenging and was not nearly as stressful as other interview series that i have engaged in.
Perguntas de entrevista [1]
Pergunta 1
Describe a time when a project partner wasn't performing up to spec and how did you handle it?
Fiz uma entrevista na empresa Texas Instruments (Dallas, TX).
Entrevista
There was only one interview and they gave me an offer. They asked me some technical and general questions and gave me some practice problems related to what I have learn in school
Candidatei-me por meio de uma faculdade ou universidade. O processo levou 4 semanas. Fui entrevistado pela Texas Instruments (Dallas, TX) em jan. de 2017
Entrevista
Multiple Phone Interviews over a few weeks, asked about work and project experience. Asked about course description and detailed lab experience. The whole process took about 4 weeks to get back to me. Very throughout interview process.
Candidatei-me por meio de uma faculdade ou universidade. Fiz uma entrevista na empresa Texas Instruments.
Entrevista
Applied for Product Marketing Engineer Intern position. Interview process took about two months. I applied on campus through a career fair and then was asked to interview on campus later that week. About a month later there was a video interview with a manager. After that I was in contact with my recruiter to stay up to date on my application status.
Perguntas de entrevista [1]
Pergunta 1
Both interviews consisted of behavioral questions about leadership, teamwork, etc. No outright technical questions, but I was asked to talk about some of the projects listed on my resume.