Candidatei-me por meio de uma faculdade ou universidade. Fui entrevistado pela Apple (Ann Arbor, MI) em jan. de 2017
Entrevista
I applied through university recruiting, and I interviewed in the UMich. The interviewer first asked me questions about stress-strain curve, basic dynamics, and beam bending. Then went to more open-ended questions described below.
Perguntas de entrevista [1]
Pergunta 1
How will you drill a hole on a cylinder? Give me 5 ways.
I received an invitation for an internship opportunity, which I was genuinely excited about because the company seems like a great place to work and grow professionally. After I replied, however, I did not hear back, which was a little disappointing. The communication process could definitely have been better, but my overall impression of the company remains very positive. It still looks like an excellent workplace, and I would be happy to have the chance to join the team in the future.
Candidatei-me por meio de uma faculdade ou universidade. Fiz uma entrevista na empresa Apple.
Entrevista
45 min screening round. asked general questions about the physical design process including basics like setup/hold. asked me to draw circuits and basic digital design concepts. wasn't too difficult but they ghosted me
Resume based shortlist and interview of 2 rounds core concept based questions only no dsa i only attended round 1 didnt shortlist for round 2 it was easy but my interviewer were asking situation based questions