Candidatei-me por meio de uma faculdade ou universidade. O processo levou 1 dia. Fui entrevistado pela Cyient (Hyderābād) em nov. de 2013
Entrevista
campus placement
package 3.5 but 3 years bond
online written exam by cocubes.com
1.written exam 2.technical round 3. HR
written exam is avg level.
technical round is about strength of matertils sfd bmd etc ... and composite materials
if u clear t.r then interview round is easy to get in..
Perguntas de entrevista [1]
Pergunta 1
be strong in units and sfd and bmd diagrams ..u can get in easily
Candidatei-me por meio de uma faculdade ou universidade. O processo levou 7 semanas. Fiz uma entrevista na empresa Cyient (Hyderābād).
Entrevista
Crazy mind blown up to eat like this only one paid for the product Suddenly stops and plays the product Suddenly stops and plays the role of him in cyient mins to
Perguntas de entrevista [2]
Pergunta 1
What's app you have to recall everything is fine with me and plays the
Basic Mechanical engineering questions. Design, GD&T based questions. Took less thanI had a basic mechanical engineering interview that included design and GD&T based questions. The interviewer was friendly, and the whole process took less than 15-20 minutes. Overally very easy interview. 15-20 mins. The interviewer was friendly.
Candidatei-me por meio de uma faculdade ou universidade. O processo levou 4 semanas. Fui entrevistado pela Cyient (Hyderābād) em dez. de 2023
Entrevista
The Hiring process starts with a written exam consisting of few sections such as Aptitude, English and Mechanical Engineering core fundamentals. After the written exam there will be 2 rounds. Technical and HR.
