Candidatei-me pessoalmente. O processo levou 3 semanas. Fui entrevistado pela Honeywell (Hyderābād) em jun. de 2021
Entrevista
Interview had 3 rounds , all the three were technical rounds. Covered protocols, Board designing topics, Layout, Testing, Firmware , Thermal, SIL, MTBF, FMEA.
HR Round is mostly about salary negotiation.
