Candidatei-me online. O processo levou 1 semana. Fui entrevistado pela IBIDEN Electronics Malaysia (Batu Kawan) em fev. de 2011
Entrevista
my our company use PCB or PWB, Process:
1. Lamination- Laminate the PCB.
2.Plating - Cu-plated into PCB,E-Less cu.
3.Patterning - Apply patten in PCB.
4.Laser/Drill- All PCB using by laser & drill to control depth hole.
5.Suface/Back end- Check the PCB surface.
