first round is aptitude and SQL. second round is programming test and puzzle third round is hr round. Three years bond aslo here so,if u are oki with that u can attend that company

I have applied from the company's LinkedIn post. After a month I got a mail regarding 1st round which is aptitude basic questions where asked and it was quite easy to crack and then after a week i got shortlisted mail and then 2nd round is scheduled after 10 days from the mail which is L1 & L2 . At the L1 interview day the hr did a presentation about the work culture , package and commitments of the company which is 3 years service agreement .after the presentation the willing candidates are moved to attend the L1 which contains 2 questions each question will consist a programming question and a general puzzle medium and hard level clearing the medium level will lead to hard level they displayed the questions and asked us to write down the program in any preferable language on a paper. the duration is around 45 mins and then they collected the answer sheets and allocated panel members for us the panel members are friendly and asked about the approach that we did to solve the questions and then the answer for the puzzle unfortunately i did'nt clear the medium question. the panel member gives feedback and suggestions about my answers which is a nice thing..