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      Intel Corporation

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      Buscas relacionadas: Avaliações da empresa Intel Corporation | Vagas da empresa Intel Corporation | Salários da empresa Intel Corporation | Benefícios da empresa Intel Corporation
      Entrevistas da empresa Intel CorporationEntrevistas do cargo de PACKAGING R&D ENGINEER da empresa Intel CorporationEntrevista da empresa Intel Corporation


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      Entrevista para PACKAGING R&D ENGINEER

      4 de nov. de 2019
      Candidato(a) sigiloso(a) à entrevista
      Chandler, AZ
      Nenhuma oferta
      Experiência neutra
      Entrevista com nível médio de dificuldade

      Candidatura

      Candidatei-me por meio de uma faculdade ou universidade. O processo levou 1 dia. Fui entrevistado pela Intel Corporation (Chandler, AZ) em set. de 2019

      Entrevista

      I applied through my University's job application portal: Handshake and was called the next day for a phone screen directly by the Hiring Manager. After a week, I was invited on-site at Intel, Chandler for a day-long interview. It was scheduled from 9 am to 5 pm, meeting 1:1 with 2 mechanical engineering team leads and 3 senior engineers with several breaks in between. There were 4 other candidates interviewing that day. The 1:1 interviews were a mix of behavioral and technical questions, mostly asking about my previous experiences and things on my resume. The technical questions were mechanical engineering-related: stress-strain curve, heat transfer, CTE, DOE, Statistical Analysis, DFM, Structural Mechanics, FEA and injection molding. Most of the questions were testing problem-solving ability and how one thinks out of the box. The last 1 hour was scheduled for a Solidworks test, in which, I was given an isometric view of a tool holder to be designed as a 3D model, followed by assembly and 2D drafting and dimensioning. Ask several questions along the way, if you get stuck, ask. The design test was really interesting and was geared to test one's comfort with Solidworks, how one dimensions, and the use of correct steps to achieve an efficient output (Least number of clicks and keystrokes). Negatives: It was a great experience overall, everyone there was positive and cheerful. However, after the interview, it took them 1 month to send a rejection email, that too an automated one with no feedback. When asked for feedback, no one replied. I was asked to fill out a reimbursement form to cover the travel for the interview, but, never got the reimbursement. Not that I care about the reimbursement, but no feedback is very unprofessional.

      Perguntas de entrevista [7]

      Pergunta 1

      What is CTE Mismatch? How can it be avoided?
      Responder à pergunta

      Pergunta 2

      Draw and explain the Stress-Strain curve.
      Responder à pergunta

      Pergunta 3

      Draw and explain an SFD and BMD for a simply supported beam.
      Responder à pergunta

      Pergunta 4

      What is Root Cause Analysis and explain your project?
      Responder à pergunta

      Pergunta 5

      Given the choice of Flathead and Philips head screw, which would you select? What are the advantages and disadvantages of both?
      Responder à pergunta

      Pergunta 6

      What are some DFM considerations when designing for Injection Molding?
      Responder à pergunta

      Pergunta 7

      Which material would you select if the product needs to have a high cosmetic value, needs to be hard and have the ability to withstand constant thermal cycling?
      Responder à pergunta
      1

      Outras avaliações de entrevista de vagas de PACKAGING R&D ENGINEER da empresa Intel Corporation

      Entrevista para PACKAGING R&D ENGINEER

      27 de abr. de 2022
      Funcionário(a) sigiloso(a)
      Oferta aceita
      Experiência positiva
      Entrevista com nível médio de dificuldade

      Candidatura

      Candidatei-me online. Fiz uma entrevista na empresa Intel Corporation.

      Entrevista

      The team was very friendly but asked keen questions from my resume. The hiring manager mostly asked questions about my fit for the position. Very constructive interview with lots of learning.

      Perguntas de entrevista [1]

      Pergunta 1

      What exactly do you expect for this role?
      Responder à pergunta

      Entrevista para PACKAGING R&D ENGINEER

      28 de fev. de 2022
      Funcionário(a) sigiloso(a)
      Oferta aceita
      Experiência positiva
      Entrevista com nível médio de dificuldade

      Candidatura

      Fiz uma entrevista na empresa Intel Corporation.

      Entrevista

      Initial phone call interview, was described the position and asked a few questions relating to knowledge of polymer science and instrumental analysis. Then was allowed to ask a few questions back to the interviewer.

      Perguntas de entrevista [1]

      Pergunta 1

      Strengths and weaknesses? Describe an instrument, how it functions?
      Responder à pergunta

      Entrevista para PACKAGING R&D ENGINEER

      22 de fev. de 2022
      Funcionário(a) sigiloso(a)
      Oferta aceita
      Experiência positiva
      Entrevista com nível médio de dificuldade

      Candidatura

      Fiz uma entrevista na empresa Intel Corporation.

      Entrevista

      1. 1 st round is a 30 min phone screening 2. 2nd round is an 1h presentation on research and nine 1:1 sessions. most questions are about presentation. also ask a lot of behavior questions.

      Perguntas de entrevista [1]

      Pergunta 1

      1. why do you want this job
      Responder à pergunta

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