Candidatei-me por indicação de um funcionário. O processo levou 1 dia. Fui entrevistado pela Intel Corporation (Chandler, AZ) em mar. de 2012
Entrevista
I submitted my resume in the system, and I got a phone interview with an engineering in 30 minutes regarding my research. After I passed a phone interview, I got on-site interview. There are three other candidates with different engineering backgrounds. We took turns to interview with 4 team members and finally got an interview with a hiring manager. After all interviews were done, and we presented our research to the team members. It was a day-long process.
Perguntas de entrevista [1]
Pergunta 1
Difficult questions were coming from the current technical issues they had been experiencing in the process. Basically, how can we dispose polymer in the packaging process when certain sets of devices and conditions were given? The velocity of a dispenser and the amount of polymer are key outcome while varying temperature, viscosity, and configurations of polymer. You have to know about the relationship between viscosity and force and the characteristics of polymer. Another important thing that you should remember is how temperature is affecting the shear force of polymer. There are rare happenings of brimming over the die package specification. You should know about why it is happening, how you can handle it, and what might be the solution techniques at least in a brief format.
Very easy interview process. It took 3 months to get the offer. great work experience, poor management. strict deadlines. stressful, no work life balance, low salary, poor communication between upper management and engineers. lots of office politics
Candidatei-me online. Fui entrevistado pela Intel Corporation em mai. de 2024
Entrevista
The manager emphasized questions about teamwork and collaboration, since my technical expertise had already been demonstrated and was not a concern during the interview process. The manager and his colleague took turns asking questions.
Perguntas de entrevista [1]
Pergunta 1
How do you resolve conflict, how do you prioritize projects, how do you mentor and train junior engineer?,...
Candidatei-me online. O processo levou 2 meses. Fui entrevistado pela Intel Corporation (Kuala Lumpur) em out. de 2022
Entrevista
Virtual interview with the Director and Hiring Manager and it took almost one hour. They were looking for equipment engineer for their new process. Mostly talking about how I could contribute.
