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      Intel Corporation

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      Buscas relacionadas: Avaliações da empresa Intel Corporation | Vagas da empresa Intel Corporation | Salários da empresa Intel Corporation | Benefícios da empresa Intel Corporation
      Entrevistas da empresa Intel CorporationEntrevistas do cargo de Thin Films Module Engineer da empresa Intel CorporationEntrevista da empresa Intel Corporation


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      Entrevista para Thin Films Module Engineer

      9 de fev. de 2022
      Funcionário(a) sigiloso(a)
      Hillsboro, OR
      Oferta aceita
      Experiência positiva
      Entrevista com nível médio de dificuldade

      Candidatura

      Candidatei-me por indicação de um funcionário. O processo levou 2 semanas. Fui entrevistado pela Intel Corporation (Hillsboro, OR) em set. de 2021

      Entrevista

      The whole process was remote (online). Phase 1: Intel recruiter emailed me to apply for this position as I had been referred internally by an Intel employee, whom I met at a conference (perks of going to conferences). Then received an email from a senior team member for a phone interview which was about 45 minutes long, or maybe an hour long. It was mostly like a conversation, and occasional specific questions about my Ph.D. research, troubleshooting experiences, etc. Tip - Be excited when you converse, show great interest in the company and the role. It is all about convincing them why they should spend an entire day knowing you more. Phase2: About a couple of days later, the hiring manager from the team emailed to set up a whole day interview which consisted of seven 1-1 interviews (with the whole team - engineers, group leaders, and senior engineering manager), and a 1-hour presentation on the PhD work. All the interviews mostly focussed on what I did during my PhD, what kind of research equipment I worked with, why I did what I did, troubleshooting, experience with the advisor, fellow grad students, conflict resolutions with lab mates and advisor, safety protocols, grasp on research methodology. Tip: Identify different situations from your experience to address questions on these topics and be ready to recall them when asked, a lot of questions will be asked. Time was given after each interview to ask questions, so prepare a lot of questions - about the role, company, team, etc. Phase 3: After the interview, received an email for a background check after 2 days which was a good sign, and finally got the offer after a week of the interview.

      Perguntas de entrevista [1]

      Pergunta 1

      Research experience, conflict resolutions, importance to safety, mistakes you made, what you learned from mistakes, working in a team, how to tell a senior/teammate that they are wrong!
      Responder à pergunta
      2

      Outras avaliações de entrevista de vagas de Thin Films Module Engineer da empresa Intel Corporation

      Entrevista para Thin Films Module Engineer

      16 de jan. de 2022
      Funcionário(a) sigiloso(a)
      Portland, OR
      Oferta aceita
      Experiência positiva
      Entrevista com nível médio de dificuldade

      Candidatura

      Candidatei-me por indicação de um funcionário. O processo levou 1 dia. Fui entrevistado pela Intel Corporation (Portland, OR) em jan. de 2022

      Entrevista

      Had online interviews with 6 interviewers in Jan, 2022. It took me ~3 hours in the morning. The interviewers included 2 engineers and 4 group leaders. It covered technical and behavioral questions. And, it was going well.

      Perguntas de entrevista [1]

      Pergunta 1

      What is your hand-on experience for a PVD chamber?
      Responder à pergunta

      Entrevista para Thin Films Module Engineer

      7 de mar. de 2021
      Funcionário(a) sigiloso(a)
      Hillsboro, OR
      Oferta aceita
      Experiência positiva
      Entrevista com nível médio de dificuldade

      Candidatura

      Candidatei-me por indicação de um funcionário. Fiz uma entrevista na empresa Intel Corporation (Hillsboro, OR).

      Entrevista

      A long but friendly interview. Started with a phone screen from an engineer which lasted about an hour. A month later, I was contacted to schedule the panel interview. On the panel interview day, I had 6 interviews with hiring manager, group leaders, fellow engineers etc. and my own research presentation. Questions were mostly from my presentation and resume on how I solved each problem, why did I choose particular techniques etc.

      Perguntas de entrevista [1]

      Pergunta 1

      Troubleshoot instrument, conflicts with workers, a particular problem in your PhD that you had solved, when do you stop troubleshooting yourself and ask for help. Did you ever modify a machine ? Basics of SEM, CVD, XRD etc.
      1 resposta
      2

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