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      Buscas relacionadas: Avaliações da empresa Intel Corporation | Vagas da empresa Intel Corporation | Salários da empresa Intel Corporation | Benefícios da empresa Intel Corporation
      Entrevistas da empresa Intel CorporationEntrevistas do cargo de Senior Packaging Engineer da empresa Intel CorporationEntrevista da empresa Intel Corporation


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      Entrevista para Senior Packaging Engineer

      17 de jul. de 2015
      Candidato(a) sigiloso(a) à entrevista
      Phoenix, AZ

      Outras avaliações de entrevista de vagas de Senior Packaging Engineer da empresa Intel Corporation

      Entrevista para Senior Packaging Engineer

      11 de fev. de 2019
      Candidato(a) sigiloso(a) à entrevista
      Chandler, AZ
      Nenhuma oferta
      Nenhuma oferta
      Experiência neutra
      Entrevista com nível médio de dificuldade

      Candidatura

      Candidatei-me online. O processo levou 2 semanas. Fui entrevistado pela Intel Corporation (Phoenix, AZ) em jun. de 2015

      Entrevista

      Phone Interview, Followed by on-site, The whole process took 2 weeks. The onsite interview included 7 interviews in total, one after the other in a very busy schedule. They also ask me to do a one hour interview about my research. The interviewers were nice and friendly but the whole thing felt rush.

      Perguntas de entrevista [1]

      Pergunta 1

      Tell me about your research
      Responder à pergunta
      Experiência positiva
      Entrevista com nível médio de dificuldade

      Candidatura

      Candidatei-me por meio de uma faculdade ou universidade. O processo levou 4 semanas. Fui entrevistado pela Intel Corporation (Chandler, AZ) em dez. de 2018

      Entrevista

      I interviewed with two teams back-to-back. The first team was Materials Technology Development with whom I interviewed from 8am-2pm including 1 hr of lunch in between. There was no presentation and all the interviews which lasted from 30 minutes- 1hr were focused on my PhD research. There was one technical round in which I was asked questions related to stresses in packaging. The second team was Module engineering with whom I interviewed from 2pm - 6pm including first 1 hour of my presentation. The questions in all the interviews from this team were completely behavioral.

      Perguntas de entrevista [1]

      Pergunta 1

      How do you deal with stress? (Module Engineering)
      Responder à pergunta

      Entrevista para Senior Packaging Engineer

      6 de nov. de 2015
      Candidato(a) sigiloso(a) à entrevista
      Chandler, AZ
      Nenhuma oferta
      Experiência negativa
      Entrevista difícil

      Candidatura

      Candidatei-me online. O processo levou 1 dia. Fui entrevistado pela Intel Corporation (Chandler, AZ) em jul. de 2015

      Entrevista

      Onsite interview. But they never sent me an agenda. So on the interview day, I didn't even know when I would give a presentation or who would interview me or how many people I would expect to talk to. The interview started with one on one interview. (strange, isn't it?) After I interviewed with all managers and director, my host took me to another building to interview with VP. But VP didn't show up. So my host took me back and then I gave an 1 hour presentation to 3 people (my host, a manager and my HM). The manager asked me a lot of unrelated background questions. I don't work in that area. I don't know all the answers. But he kept asking even I told him I was not working in that area. HM was not even listening. Her computer had some problems that she could not even login. So she was dealing with that computer all time long till the end of my presentation. Very unprofessional! After I came back, I sent a thank you letter to everyone, but didn't hear back. After 4 weeks, I sent out a followup to HM, and didn't hear back. Another week later, I received a rejection email sent by the application system.

      Perguntas de entrevista [1]

      Pergunta 1

      What is enthalpy
      Responder à pergunta
      1