O processo levou 1 dia. Fui entrevistado pela Intel Corporation em mai. de 2011
Entrevista
Notified by email that they wanted to set up a phone interview. I focused on the job qualifications structural boundary condition definition, first order calculations, heat sink knowledge and calculations.The questions they asked were you know it or you do not, ie basic heat transfer equations, property of materials, statics, dynamics, etc.
Fiz uma entrevista na empresa Intel Corporation (Bengaluru).
Entrevista
Campus interview was conducted for us for the post of internship in thermal engineering.But no PPO was offered afterwards as their were no clause so if your college has a policy of allowing to sit for FTE then that's a good option otherwise think wisely
Candidatei-me online. Fui entrevistado pela Intel Corporation (Guadalajara, Jalisco) em out. de 2023
Entrevista
Good Interview, the interviewers were very kind and open, they explained everything and were very clear. The topics were very complex all related to Thermodynamics and component design, more case driven questions than specific questions.
Perguntas de entrevista [1]
Pergunta 1
How to redesign a thermal sink to make it more efficient?
Candidatei-me por indicação de um funcionário. O processo levou 3 semanas. Fui entrevistado pela Intel Corporation (Portland, OR) em jun. de 2023
Entrevista
Started with HR round then two technical rounds followed by a Hiring manager round. Each one lasted a minimum of 30 minutes. Since the job I applied was entry level they didn't ask complex questions.
Perguntas de entrevista [1]
Pergunta 1
Basic Mechanical Engineering questions and Stuff related to cooling, heat dissipation
