The interview process consisted of two rounds. First Round: The focus was on core image processing and machine learning concepts. The interviewer asked questions in great detail, probing into foundational topics to assess depth of understanding. In addition, I was given two coding questions, which were fairly easy and aimed at evaluating logical clarity and coding skills. Second Round: This round was similar in structure but slightly more advanced. It again covered CV/ML fundamentals, with a focus on in-depth understanding. There was one coding question, and I was asked to explain the logic behind my code thoroughly. This round also included behavioral and case-based questions. Some examples included: “Describe a failure you’ve experienced and how you reacted to it.” These were aimed at understanding how I approach interpersonal challenges and setbacks.

Three round interview were conducted including HR round, 1st Round was telephonic Resume Screening. 2nd Round was core Technical 3rd round was HR Discussion Technical interview was very tough, All the Higher management person are there in interview, It was related to Assembly Process planning.