Candidatei-me por meio de recrutador(a). O processo levou 2 dias. Fui entrevistado pela Radiant Appliances and Electronics (Hyderābād) em jan. de 2021
Entrevista
telephonic interview and next round is virtual interview final round where they asked more about technical questions and hr discussion about salary and other details.finally offer letter. and acceptance of offer.
Candidatei-me por meio de uma agência de recrutamento. Fui entrevistado pela Radiant Appliances and Electronics (Hyderābād) em fev. de 2021
Entrevista
Interview for sap executive with 3 rounds
First round is a written test with sapmm end user t codes
Second round is aptitude test and final round is with the hiring manager
