Basics about Strength of material and finite element analysis, also discussed about softwares used like hypermesh, ansys and patran. Interview process started with basics of SOM, FEA and then Software knowledge, after technical round, there was HR round in which salary negotiations and company details were discussed

It's good some how first round is written test with 50 min in that they asked about c,output prediction and aptitude 15 questions and digital electronics 10question. It's though for me to attend that question