I met the TI recruiters at the Purdue Career fair and they put me down for an interview with a senior engineer next day the the campus. The on-campus interview lasted for about an 1.25 hours and the engineer was really nice, informative and told me at the end of the interview that he will likely put me down for the next round. I was contacted my email by the HR from Dallas 2 weeks later for a Skype-time video interview on a platform TI use. I interviewed with 2 senior engineers from Dallas who worked with the 64 bit DSP processor team for about 1.5 hours. The interview started with a presentation on my thesis work, while they asked technical questions as they came across them on my presentation. I thought the interview went well but I got a reject 2 weeks later telling me while it was very close, they went with someone else for the position. It wasn't clear whether this was the last round but it seemed that from the rejection email I got.