The interview process consisted of four rounds: Two technical interviews focusing on my academic and project background, as well as my core job-related skill sets. These rounds evaluated my understanding of digital IC design/verification concepts, hands-on experience with industry tools, and my ability to troubleshoot and reason about engineering problems under pressure. One interview with the BU leader, which concentrated on my communication abilities, teamwork mindset, ownership, and overall cultural alignment with the team’s working style and expectations. This round assessed whether my working habits and long-term growth potential matched the BU’s needs. The final HR interview, where compensation details, role level, and onboarding procedures were discussed. HR also reviewed my career goals to ensure alignment with the organization’s long-term talent development framework.