Candidatei-me por meio de uma faculdade ou universidade. Fui entrevistado pela iLenSys em jan. de 2023
Entrevista
It consists of two rounds,both are technical interviews , first round is about fundamentals in the core subjects and it is a elimination round. Second round is about depth in the core subjects and it is also a elimination round,it is very difficult compared to the first round.
Perguntas de entrevista [1]
Pergunta 1
Questions are about the core subjects mentioned in the resume
Candidatei-me por meio de uma agência de recrutamento. O processo levou 2 semanas. Fui entrevistado pela iLenSys (Hyderābād) em ago. de 2019
Entrevista
Schematic symbols creation using OrCAD Capture 17.2
Bill Of material and net list creation
Footprint creation considering IPC Standard.
Net list Importing to the Layout
Setting up the DRC rule as per PCB Fabricator capability
Placement of the layout (as per Routing, Placement Guidelines)
Checking the Layout with QC Engineers
Preparation of Gerber, NC Drill files for PCB fabrication
Support to PCB manufacturer regarding Stack up as this board having high speed, multiple impedance requirements and metal core PCB
Fui entrevistado pela iLenSys (Hyderābād) em jul. de 2012
Entrevista
It consisted of two rounds.
First round was a written test. It consisted of fundamental questions.
Second round was Technical & personal interview.
In the second round they asked questions like
tell me about yourself and then questions based on resume like describe about your project, can you show us how first angle projection is represented. basic questions of drawing.