Candidatei-me por meio de uma faculdade ou universidade. O processo levou 1 dia. Fui entrevistado pela SAP em mai. de 2013
Entrevista
2 technical 1 HR. It was technical cum HR. Just be confident is what i would say to crack this interview. Nothing to worry about this 2 technical 1 HR. It was technical cum HR. Just be confident is what i would say to crack this interview. Nothing to worry about this
Candidatei-me por meio de uma faculdade ou universidade. O processo levou 3 dias. Fui entrevistado pela SAP (Calecute, ) em set. de 2024
Entrevista
Coding round followed by interviews.
OOPS and Java were main topics followed by project discussion.
Interviewers were mainly new joiners and the interview was offline.
CTC: 30 LPA. Diversity hiring.
Perguntas de entrevista [1]
Pergunta 1
Major questions were about interfaces in java. Then to design hashmap in java. Then a good high level and low level discussion about my project which ustilised docker and aws which had a good impact. Unfortunately they resorted to diversity hiring.
Candidatei-me por meio de uma faculdade ou universidade. O processo levou mais de 1 semana. Fui entrevistado pela SAP (Calcutá) em out. de 2023
Entrevista
Was a smooth process. 1st was a coding round after which there were 2 technical rounds.. Each was an elimination round and after that we had one last HR round
Perguntas de entrevista [1]
Pergunta 1
Data Structure and Algorithms and Database related questions
Candidatei-me online. O processo levou 1 semana. Fui entrevistado pela SAP (Tel Aviv-Yafo) em ago. de 2022
Entrevista
applied for the job, after day or two they sent a link to online assesment. the assesment was 2 question 1 hour. techmical questions, equal about to 1 easy and 1 medium on leetcode